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 These range from major collaborative R&D projects such as Esp@ss-is, MASSC and HIDICCA to cooperation with competitors with a view to establishing industry standards.
ST is actively
involved in the MEDEA+ project, EsP@ss-IS (Enhanced
Smart card Platform for Accessing Securely Services of the
Information Society) with Axalto, Telecom Italia
Mobile, Thomson, Philips Consumer Electronics,
Viaccess, Trusted Logic and research institutes such as
the CEA-LETI and TIMA. The ST22FJ1M product was developed using the R&D work of the EsP@ss-IS project.
Previously, in the MEDEA project, MASSC (“Multi Application Secure Smart card”), ST worked with partners such as Bull, Oberthur and INRIA to develop an open platform that includes innovative design methodologies that support both fast development cycles and formal security certification. The ST22 platform was developed using the R&D work of the MASSC project.
In the European ESPRIT project HIDICCA (“High Density ICs
for Cards”), ST worked with Bull and FNMT to develop a high-security
chip platform aimed at multi-application smart cards. The end
product from this project was the ST19 platform, which major smart
card manufacturers have chosen as the successor to the popular
ST16.
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