| Vol. 3, No. 1, August 2006- Art. 4 |
| |
| Novel process for realization of multiple axis actuators
suitable for the realization of an optical switch |
|
 |
by
Marco Del Sarto, Simone Sassolini, Mauro Marchi, Lorenzo
Baldo, STMicroelectronics
Copyright
Copyright 2005 Society of Photo-Optical Instrumentation
Engineers.
|
| | |
|
Abstract
A new MEMS for on-chip mechanical testing of 0.7 µm thick
LPCVD polysilicon film has been designed, modelled, and fabricated.
The polysilicon film is electrostatically loaded under bending
until rupture in the out-of-plane direction. Electrostatical numerical
simulations were carried out to evaluate the force developed by
the actuator and the capacitance measured by the sensing electrodes
while structural numerical simulations were used to compute the
stress field into the specimen and its stiffness. Elastic properties
and ultimate strength of the material were determined. Comparative
studies were performed to investigate the variation of the ultimate
strength of the polysilicon film with different loading conditions.
|
| |
| |
|
