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Out of plane vs. in plane flexural behaviour of thin polysilicon
films:
mechanical characterization and application of the Weibull approach |
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by
F. Cacchione, A. Corigliano - Politecnico di Milano, B.
De Masi, C. Riva - STMicroelectronics
Copyright
Copyright © Elsevier, 2005 - Reprinted from Microelectronics
Reliability 45 (2005) 1758–1763, doi:10.1016/j.microrel.2005.07.090
http://www.elsevier.com/wps/find/ journaldescription.cws_home/274/description#description
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Abstract
A new MEMS for on-chip mechanical testing of 0.7 µm thick
LPCVD polysilicon film has been designed, modelled, and fabricated.
The polysilicon film is electrostatically loaded under bending
until rupture in the out-of-plane direction. Electrostatical numerical
simulations were carried out to evaluate the force developed by
the actuator and the capacitance measured by the sensing electrodes
while structural numerical simulations were used to compute the
stress field into the specimen and its stiffness. Elastic properties
and ultimate strength of the material were determined. Comparative
studies were performed to investigate the variation of the ultimate
strength of the polysilicon film with different loading conditions.
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