Section
Author's Guide | Reviewer's Guide

ST Journal of System Research
Wireless Communications

Vol. 1, No. 1, February 2004 - Art. 1
 
Overview of Physical Layer for 3G Low Chip Rate TDD Systems

by
Ser Wah Oh, Muralidhar Karthik, Christopher A. Aldridge (STMicroelectronics)

Copyright
© STMicroelectronics, 2003
 
Abstract
This paper reviews the 3GPP standard based on TD SCDMA technology (termed UMTS Terrestrial Radio Access Low Chip Rate Time-Division Duplex UTRA LCR TDD). We first present a brief overview of the system followed by more detailed descriptions of the physical layer of UTRA LCR TDD. We then discuss the various features of UTRA LCR TDD and explain the rationale of the selection of these features by focusing on the unique features of UTRA LCR TDD rather than offering lengthy discussions on every single feature common among different systems. Finally, some success factors for 3G are also mentioned for positioning our research and development activities in a correct direction.
 
 

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